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Allegro Package Designer Plus
Allegro Package Designer Plus 提供完整的IC封裝設計,協助各式IC封裝型式- Lead Frame、WireBond、flip-chip 、3D IC 或Interposer 等等從傳統到最先進的封裝應用
公司電話:+886-3-271-1599
♦EDA tool solutions from system level, RTL, to GDSII, to manufacture, and to PCB
♦Software, middleware and silicon IP solutions, from multimedia and communication application to fundamental building libraries, memories and macros.
♦Integrated EDA and IP as the value up solutions through professional consulting and services.